Esec

Esec is a leading global provider of chip assembly equipment, processing techniques and system solutions for the semiconductor industry. Our equipment and solutions are utilized in what is known as the backend segment of semiconductor production.

The core business encompasses die attach (Die Bonders and Flip Chip Bonders) and wire bonding (Wire Bonder) equipment.

Unique know-how in the area of mechatronics, highly qualified employees, intensive cooperation with suppliers, and a global network of sales centers are the key factors of our success.

Headquartered in Cham (Switzerland), Esec employs around 400industry experts and operates Sales & Service centers in Europe, the USA, and key Asian markets.