Company Overview
Esec is a leading global provider of chip assembly equipment, processing techniques and system solutions for the semiconductor industry.
Esec solutions are utilized in what is known as the back-end segment of semiconductor production.
Market Areas & Core Competencies
The core business encompasses Esec Die Attach (Die Bonders and Flip Chip Bonders) and Esec Wire Bonding (Wire Bonder) products.
Headquartered in Cham (Switzerland) and in Singapore for South East Asia, Esec employs around 630 people and operates seven service centers in Europe, USA and in other key markets.
Products & Solutions
Esec processes a wide range of semiconductor components used in computers, telecommunications, consumer electronics, medical devices, and the automotive industry. They represent the heart of leading-edge products such as PCs, mobile phones, PDAs, TV sets, DVD players, sensors, smart cards and the like.
Esec equipment is also used in flip chip assembly, as well as in the assembly of optoelectronic devices and other semiconductor modules (e.g. MEMS) that require extremely accurate (5 µm) mechanical placement of small parts.
Headquarters
Esec AG
Hinterbergstrasse32
CH-6330 Cham
Switzerland
Tel. +41 41 749 51 11
Fax +41 41 749 51 77
Major locations
Esec has R&D and manufacturing sites in Switzerland and Singapore. Customer Service Centers (CSCs) are located at the following countries:
- Switzerland
- Singapore
- China
- Taiwan
- South Korea
- Japan
- USA