Esec Die Bonder
January 2003 - Advanced Packaging Magazine
Reducing Air Bubbles during the Process
The reliability of a plastic package is reduced by the presence of bubbles, since moisture can accumulate there. Solder reflow causes the moisture to vaporize and can lead to cracks in the mold compound. What generates bubbles in polyimide adhesive tapes during die attach? A mechanism for the formation of decompres- sion bubbles is discussed, and it is suggested that bubble formation can be reduced by a slower pressure release and by lead frame geometries with less uncovered tape area between leads.
April 2002 - Advanced Packaging Magazine
Advanced Packaging's Step by Step
In back end semiconductor manufacturing, the die attach process is a critical step. In simple terms, die attach is picking a silicon chip from wafer and placing it onto an organic substrate or metal lead frame. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding.
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Josef Schuler
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