NEW Die Bonder 2100 FC
Mass Production Flip Chip Bonding
Flip chip in high volume production means more cost pressure, both in investment and in operating cost. Flip chip bonding on low cost substrates like metal leadframes is seeing fast growth. Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders – an aggressive approach to driving down the cost of flip chip technology.
Highest UPH - No Time Wasted
- Simultaneous movement of chip and camera - no time wasted for image taking
- Low vibrations - no time wasted for motion settling
- Innovative parallel activity machine design with Phi-Y movement pick-and-place
- Focused on strip based products
Load & Run - Shortest Time to Yield
- Load recipe from host and run on any machine
- Full recipe transfer from machine to machine
- Operator independent results ensured by auto calibration
Highest Up Time - Consistent Quality
- Reliable and accurate flip chip process
- Smart and safe wafer mapping
2100 Platform Synergies - Reduced Operating Cost
- One compact flip module is all that makes the difference to epoxy die bonders of the 2100 platform
- Most spare parts are the same - lean stock and high availability
- Flexible workforce - cross-trained operators and support teams
- Contact
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Sales & Service
Josef Schuler
T: +41 41 749 51 11
sales.esec@besi.com
Esec AG
Hinterbergstrasse 32
6330 Cham
Switzerland