Glossary
A
Assist
Any unplanned interruption or variance from specifications of equipment operation that requires human intervention of fewer than six minutes to correct. After six minutes has elapsed, an assist becomes a failure. If intervention is required, but there is no interruption of operation within specifications and no component is replaced, the action is deemed to be an assist independent of its duration.
B
Ball bonding
A thermosonic bonding technique. The wire end is melted to form a ball, which provides a larger area of contact than otherwise possible.
Ball bump bonding
Ball bump bonding places a gold ball bump on an active circuit prior to bonding the wedge bond of the associated interconnecting wire. Used for stacked die, reverse bonding and multi-chip scale packages.
Ball Grid Array (BGA)
Type of chip package. An integrated circuit surface-mountpackage with an area array of solder balls that are attached to the bottom side of a substrate with routing layers.
Behavior Based Equipment Model (B-BEM)
Software architecture that represents equipment based on its behavior.
Bond deformation
The change in the form of the lead produced by the bonding tool, causing plastic to flow in making the bond.
Bond force
Vertical force on the bonding tool (capillary) during the bonding cycle.
Bond Line Thickness (BLT)
Determines the average thickness of the bonding material (epoxy, solder).
Bond pad
A metallized region on the top surface of semiconductor die via which electrical connection to an external circuit is made by means of a bond wire.
Bond range
The usable area of a leadframe or substrate for bonding.
Bond Vision Module (BVI)
Die bonder optical and electronic mechanism for controlling position and orientation of a chip in bonding position.
Bondhead (BHD)
The wire bonder device that performs all movements and operations necessary to bond the wire to the bond pads.
Bump chip
A chip that has on its termination pads a bump of solder or other bonding material that is used to bond the chip to external contacts.
C
Calibration (CALIB)
Setting-up a machine to a known reference condition
Capabilities (CAP)
Capabilities are operations performed by the equipment. These operations are initiated through the communications interface using sequences of SECS-II messages (or scenarios).
Capillary (HDH)
A hollow bonding tool used to guide the bonding wire and to apply force to the wire during the bonding cycle.
Carrier (FAB)
Holds the strips (leadframes) for the transfers.
Cassette
Carrier for wafers, mounted on wafer frames.
Cell
Cluster of machines under the control of a Cell Controller.
Changeover
Change of production tools (e.g. downholders, clamps, etc.).
Chip
See Die
Chip on Board (COB)
A hybrid technology that exclusively employs face-up-bonded chip devices interconnected to the substrate in a conventional manner, i.e., by flying wires. A generic term for mounting an unpackaged silicon die directly onto the PCB.
Chip Scale Packaging (CSP)
Small-footprint integrated circuit packages, sometimes defined as 1.2 times the die size; more appropriately refers to array packages nearly the same size as the chips they contain.
COB
See Chip on Board
Compressed Dry Air (CDA)
Also referred to as clean dry air.
Consumable
Material for one-time use, e.g. gold wire, epoxy.
Controlled Collapse Chip Connection (C4)
The most common example of solder-bump-based flip chip technology.
Cost Of Ownership (COO)
The total lifetime costs associated with acquisition, installation, and operation of production equipment.
Cp
See Process Capability
Cpk
See process capability index
CSP
See Chip Scale Packaging
Curing (CU)
Process step for the hardening of epoxy.
D
Die
A small piece of silicon that contains the complete device being manufactured. Also called chip or microchip.
Die Attach (DA)
Die Bonder
Die Bonder (DB)
Picks, places and bonds chips onto strips, substrates or leadframes, sometimes referred to as die attach.
Discrete
A device or component that has a single function, such as a diode or transistor.
Downholder / heater assembly
Clamps and heats the leadframe during bonding.
Downtime (DT)
The time during which equipment is not in a condition, or is not available, to perform its intended function. This does not include any portion of non-scheduled time.
Dual Wire Dispenser (DWD)
Module on a soft solder die bonder; a wire dispenser that can dispense two wires simultaneously.
E
Epoxy Process
Processes for attaching a die to a strip, substrate or leadframe through use of epoxy glue.
Eutectic Process
One of the various processes for attaching a die to a leadframe using an alloy with a minimized melting point.
F
Failure
Any unplanned interruption or variance from the specifications of equipment operation other than an assist
Fiber Optic Link (FOL)
Fiber optic connection.
Flip Chip
Flip chip interconnect technology pertains to the mounting of a chip with its active side facing the substrate.
Flip Chip in Package (FCIP)
Can be a single chip package or multichip module.
Flip Chip on Board (FCOB)
Bare single chip or multiple chips mixed with other components on a board.
Free air ball
Ball formation prior to bonding contact
G
Generic Equipment Model (GEM)
Generic Model for communication and control of SEMI equipment. Defines the behavior of semiconductor equipment as viewed through a communications link, e.g. SECS-II; provides the definition of messages and data items exchanged between the host and the equipment. GEM defines which SECS-IImessages should be used.
Graphical User Interface (GUI)
Human/machine interface (HMI).
H
Hot Lot
Lot with highest priority that will be processed next.
I
Idle
Equipment waiting in a ready state.
Integrated circuit (IC)
Chip, device.
Integrated Quality Control (IQC)
Die bonder onboard inspection system for checking quality, e.g. chip placement, leadframe fingers, etc.
Interconnection
The conductive path required to achieve electrical connection between a circuit element and the rest of the circuit.
L
Lead On Chip (LOC)
The device is fixed with a tape underneath the substrate; no curing needed.
Lead wires
Wire conductors used for intra-connections or input/output leads.
Leadframe (L/F)
Sheet metal framework upon which an integrated circuit is attached.
Leadframe Handler (LH)
Automatically loads and transports leadframes during the die bonding process.
LOC
See Lead On Chip
Local
A communication state of the equipment during which the equipment is controlled by the operator, not by the CC.
Loop – wire bond
The curve or arc of the wire between the attachment points at each end of a wire bond.
Lot
Production unit, collection of carriers or a batch of wafers processed at the same time.
M
Machine Configuration (M/C)
Mostly used as an abbreviation for “machine”.
Magazine
Carrier for strips, substrates or leadframes.
Magazine Handler (MH)
Part of die bonder or wire bonder for input or output handling of magazines.
Maintenance (MAG)
Ensuring that equipment is kept in a condition that allows it to perform its intended function.
Master Unit (MU)
The die bonder master unit controls all the modules.
MCM
See Multichip Module
Mean Time Between Assist (MTBA)
The average time during which the equipment performed its intended function between assists; productive time divided by the number of assists during that time. See assist
Mean Time Between Failure (MTBF)
The average time during which the equipment performed its intended function between failures; productive time divided by the number of failures during that time. See Failure
Mean Time To Repair (MTTR)
The average time required to correct a failure and to return the equipment to a condition in which it can perform its intended function. The sum of all repair time incurred during a specified period (including equipment and process test time, but excluding maintenance delay) divided by the number of failures during that period.
Metallization
A film pattern of conductive material deposited on a substrate to interconnect electronic components, or the metal film on the bonding area of a substrate that becomes a part of the bond and performs both an electrical and a mechanical function.
Micro Electromechanical Systems (MEMS)
A technology that combines computers with tiny mechanical devices such as sensors, valves, gears, mirrors and actuators embedded in semiconductor chips.
Micron (µm)
Unit of length equal to one millionth of a meter. Conversion: 25.4 microns equals 0.0254mm = 0.001” = 1 mil = 1,000 microinches.
Mil
One-thousandth of an inch. Equal to 25.4 microns.
Mold
Third-party equipment used to encapsulate semiconductor devices on the leadframe with a thermosetting plastic.
Multichip Module (MCM)
A packaging approach based on the interconnection of multiple bare die on a single substrate.
Multichip Package (MCP)
An MCP contains a few bare chips per package, and they can be arranged either side-by-side or stacked on top of each other. MCPs typically do not include discrete or passive components.
O
Offline programming (OLP)
Software that enables the teaching of complete or partial wire bonder recipes on a separate PC.
Optical Bond Centering (OBC)
Vision system for controlling the position and orientation of the chip in bonding position. OBC is used as a means of quality inspection as well.
P
Package
Container for a die that provides protection and connection to the next higher level of integration.
Passivation
The formation of an insulating layer directly over a circuit or circuit element to protect the surface from contaminants, moisture or particles.
Pattern recognition system (PRS)
Advanced alignment system based on object-oriented processing. Employs geometric feature analysis, making it faster and more accurate than systems using gray scale correlation.
PCB
See Printed Circuit Board
Performance Based Equipment Training (PBET)
A training technique, PBET is based on frontend analysis to ensure that qualified participants are able to achieve mastery of job skills pursuant to clearly specified and measurable learning objectives. Helps to improve the effectiveness of equipment training and to reduce instructional development time.
Pick and Place (P&P)
Module on a die bonder; plucks chips from a wafer and places them on leadframes.
Pick Vision Module (PVI)
Optical and electronic mechanism for controlling the position and orientation of chip in picking position.
Pitch or lead pitch
The distance between the center of one lead to the center of an adjacent lead.
Plasma Cleaning (PLCL)
Third-party equipment for cleaning purposes; uses ionized gas to remove residues.
Power devices
Semiconductor devices designed to handle high voltages and current. Power devices usually have a high level of heat dissipation and therefore are often soldered to a heatsink.
Pre Bond Vision Module (PBVI)
Optical check of the bond pad, epoxy or solder pattern, and leadframe fingers prior to placement in bonding position.
Printed Circuit Board (PCB)
A flat plate or base of insulating material bearing a pattern of conductive material. It becomes an electrical circuit when components are attached and soldered to it. Also simply called “board” or ”printed wire board” (PWB).
Probe damage
Any damage to the wafer surface caused by mechanical probing or measurement.
Process Capability (Cp)
Statistical process control; the ratio of the tolerance limits (specification window or upper specification minus the lower specification) of a process to the natural variation of that process (estimated by six times the standard deviation of the process output)
Process Capability Index (Cpk)
Statistical process control; a measure of process performance similar to process capability (Cp), but adjusted for any variation of the average process output from the stated target value for the process.
Programmable focus
Provides sharp images of different device levels of chip, leadframe and finger and overcomes the limited depth of focus of the standard optics.
Programmable Indexer (PI)
Part of the die bonder and wire bonder used for transporting strips, substrates or leadframes to the dispensing and bonding position.
Programmable Showerhead Dispenser (PSD)
Module on a die bonder that applies epoxy to the leadframe pad.
Q
Quad Flat Nonleaded (QFN)
Package for surface mounting with pads but no leads on quadruple sides.
Quad Flat Pack (QFP)
A plastic or ceramic package with leads that project down and away from all four sides of a square package.
Quality control TV (QCTV)
Die bonder mechanism for visual inspection of chip attachment at the bonding position.
R
Radio Frequency (RF)
Electromagnetic energy with frequencies ranging from 3 kHz to 300 GHz. Microwaves are a span of radio frequencies extending from 300 MHz to 300 GHz.
Recipe (RCP)
The pre-planned and reusable portion of the set of instructions, settings and parameters that determine how a job is to be performed. Data that defines how material is to be processed by the equipment.
Recipe transfer - Wire bond
Full recipe transfer via disk or host to ensure that the same recipe (process) is used on all machines. A recipe created on one machine can be used on any other equipment without a new setup.
Remote
Equipment communication state during which equipment is controlled by the CC.
RF
See Radio Frequency
RF Devices
A device that generates a signal in the RF bandwidth.
S
Scanning Electron Microscope (SEM)
Microscope that examines an object directly by scanning the specimen point-by-point with an electron beam; provides greater magnification than an optical microscope.
SEMI Equipment Communication Standard 1 (SECS-I)
This standard specifies a method for a message transfer protocol with electrical signal levels based upon EIA RS232-C.
SEMI Equipment Communication Standard 2 (SECS-II)
This standard specifies a group of messages and the respective syntax and semantics for those messages relating to semiconductor manufacturing equipment control.
Semiconductor Equipment and Materials International (SEMI)
An international trade association with member companies that supply equipment, materials and services used in the semiconductor manufacturing industry.
Set up time
Time it takes to prepare a machine for a product or process.
Sigma (σ)
See standard deviation
Small Outline Integrated Circuit (SOIC)
Package type for surface mounting.
Smart Card (SC)
A type of chip card; it is a plastic card embedded with an integrated circuit (IC) that stores and transacts data between users. Typically used for phone cards, bankcards, identification cards, etc. In the semiconductor industry, it can be considered as a package type.
SMEMA interface (SMEMA)
An interface standard for inline systems, defined by the Surface Mount Equipment Manufactures Association.
Snap curing
Fast curing process for snap-cure epoxy.
Soft Solder
A metal alloy with a melting point below 450 degrees Celsius.
Soft Solder Dispenser (SSD)
Module on a soft solder die bonder for dispensing a solder pattern in a single shot.
Soft Solder Process
Processes for soldering a die to a leadframe through use of an alloy with a melting point below 450 degrees Celsius.
SOIC
See Small Outline Integrated Circuit
Standard Deviation
A measure of the spread of the process output or the spread of a sampling statistic from the process (represented by the Greek letter sigma).
System-in-Package (SiP)
An SiP is comprised of one or few bare chips as well as the associated discrete and passive components, all integrated into a single package. It thus embodies all the functions of an electronic system.
T
Tail (of the bond)
The free end of wire extending beyond the bond impression of a wire bond from the heel.
Tape Automated Bonding (TAB)
A method for establishing an electrical interconnection between a die and a substrate through use of conductors on beam tape that are mass-bonded to bumps on the integrated circuit in a single operation.
Thermocompression bonding
A process involving the use of pressure and temperature to join two materials by interdiffusion across the boundary.
Thermosonic bonding
A high-yield interconnect process that uses heat and ultrasonic energy to form a metallurgical bond.
Top Stack Loader (TOS)
Die bonder input handler used for placing strips onto the indexer.
Transistor Outline Package (TO)
Package type for power devices.
U
Ultra fine pitch
Generally refers to wire bonding at pitches of 50um or less.
Units Per Hour (UPH)
The number of units a machine produces per hour.
Uptime
The amount of time during which equipment is in a condition to perform its intended function; includes productive, standby and engineering time; does not include any portion of nonscheduled time.
User Interface (UI)
Interface that enables the user to operate and control the equipment.
V
Viscosity
The “thickness” of a liquid.
Vision
Optics and electronics for controlling the position and orientation of chips, leadframe fingers, gold wires, etc. Also used for quality control.
W
Wafer
Semiconductor substrate upon which multiple die are fabricated; a thin slice with parallel faces cut from a semiconductor crystal.
Wafer Handler (WH)
Module on die bonder; loads wafers out of a wafer cassette and passes them to the picking position.
Wafer Level Packaging (WLP)
Wafer level packaging is defined as the complete packaging at wafer level. The WLP process must provide the complete packaging solution with no additional processing at the die level, neither during production nor assembly.
Wafer Mapping (WM)
Representation of usable and unusable die contained on a wafer; stored in a file.
Wafer Mapping Conversion Package (WMCP)
Data conversion from various prober formats to die bonder format.
Wire Bonder (WB)
Equipment that connects the contact pads of the device with the leads of the substrate. The most common method of making an electrical connection from a die to a substrate. The wire is bonded to the die and substrate by thermal compression and/or ultrasonic welding. Wires are typically made of gold, aluminum or copper.
Wire Dispenser (WD)
Module on a soft solder die bonder to dispense solder in wire form onto the leadframe.
X
X axis:
direction of leadframes on the indexer
Y
Y axis:
direction at right angles to the X axis, in the horizontal plane
Z
Z axis:
direction perpendicular to both the X and Y axes