Historical Milestones
When Karl Nicklaus founded Esec in 1968, he would never have dreamt that his company would soon be one of the leading suppliers of semiconductor assembly solutions worldwide.
However, the Swiss-based company grew quickly, in response to popular demand, and is now a prominent global player. Yet the ist mission has remained the same troughout: to serve the market wherever there is a need for assembly equipment that can produce packages in large quantities with low cost of ownership.
- 2009
Esec merges with Dutch company BE Semiconductor Industries N.V. (Besi).
- 2009March
Esec Introduces its new Soft Solder die bonder Generation Die Bonder 2009 SSI as a Solution for Power Packaging.
- 2010May
With its Strip Mapping E142 System for inkless production Esec introduces E-Dots(c)
- 2010May
Esec introduces the Z-Pattern(c) process for small die bonding on its Die Bonder 2100 platform.
- 2009
Redefining Stacked Die Bonding: New DB 2100 sD launched at SEMICON Korea.
- 2008
Introduction of entirely new die attach generation: the Die Bonder 2100 xP
- 2007
Integration into the Oerlikon Components Segment and renaming to Oerlikon Esec Launch of new Wire Bonder 3200. The most reliable, flexible and fastest wire bonder.
- 2006
Opening of new assembly location in Singapore
- 2005
Successful launch of the Die Bonder 2008hs
- 2005
New Wire Bonder 3100 well received in market
- 2004
Delisting of Esec Shares.
- 2004
Merger between Esec and Unaxis finalized.
- 2003
Esec and Unaxis announce merger.
- 2003
ISO 14001 first certification.
- 2002
Founding of Esec Semiconductor (Shanghai) Co. Ltd.
- 2000
Editors' Choice Best Product Award (Semiconductor International) presented to Esec for the 2008 Die Bonder.
- 1999
Editors' Choice Best Product Award (Semiconductor International) presented to Esec for semiconductor manufacturing excellence of the 3018 Wire Bonder.
- 1998
Editors' Choice Best Product Award (Semiconductor International) presented to Esec for semiconductor manufacturing excellence of the 2007 HS Die Bonder. Founding of Esec Pacific North (Taiwan) Ltd.
- 1997
Founding of Esec Philippines Inc.
- 1996
Acquisition of the Zevatech Group and thus the takeover of the Micron business.
- 1995
Founding of Esec (Korea) Ltd. in Seoul.
- 1994
Initial public offering of Esec shares on the Swiss Exchange in Zurich (September 23rd). ISO 9001 first certification.
- 1993
Founding of Esec (Europe) SA.
- 1992
Founding of Esec Holding SA, with Karl Nicklaus as Chairman.
- 1989
Introduction of the 3006 Gold Wire Bonder with flying bondhead.
- 1987
Swiss Innovation Award for leadership, innovative design, technology and production.
- 1983
Founding of Esec (Asia Pacific) Pte. Ltd. in Singapore.
- 1978
With the introduction of the first fully digital, automated goldball bonder - Wire Bonder 3000 - Esec lays the cornerstone for today′s Wire Bonder product line.
- 1975
Founding of Esec (USA) Inc.
- 1973
Introduction of the first simultaneous-transistor Wire Bonder capable of producing 2500 units per hour.
- 1970
Introduction of the first high-speed Die Bonder with an output of 2000 chips per hour.
- 1968
Founding of Esec SA in Hünenberg/Switzerland by Karl Nicklaus (November 28).