Market Segments
As a manufacturer of semiconductor assembly equipment, Esec is situated within a complex industry hierarchy.
Electronic Market
The overall market encompasses computers, mobile phones, televisions, DVD players, automotive and industrial electronics, as well as many other electronics products. This market has generated total sales of USD 1.366 trillion in 2005.
Semiconductor Market
Roughly one-sixth of those revenues, i.e. USD 227.5 billion in 2005, is attributable to semiconductor devices, commonly referred to as 'chips'.
Semiconductor Equipment Market
A variety of equipment is required to manufacture chips, and the relevant market accounted for approximately USD 23.4 billion in sales. Approximately 90% of that amount is spent on wafer fabrication equipment used for processing the silicon wafers that carry hundreds or even thousands of chips.
Assembly & Packaging Equipment Market
After the related processes are completed, the wafers are sliced into individual 'die'. In order to protect the chips and enable their micro-world to be connected to the macro-world of electronics products, the die are assembled into 'packages'. The market for the equipment that accomplishes this assembly and packaging process represented USD 2.85 billion in 2005.
Esec is a leading provider of semiconductor assembly equipment. Its main product lines are die bonders, which attach chips to the package substrate; wire bonders, which connect chips to the substrate with very fine wires; and flip chip bonders, which accomplish both of those procedures at a single pass.