Our Competencies
Esec is a leading global provider of chip assembly equipment, processing techniques and systems solutions for the semiconductor industry.
These machines and solutions are utilized in what is known as the backend segment of semiconductor production. The core business of Assembly Equipment encompasses die attach (Esec Die Bonders and Esec Flip Chip Bonders) and wire bonding. Unique know-how in the area of mechatronics, highly qualified employees, intensive cooperation with suppliers, and a global network of sales organizations (Customer Support Centers) are the key factors in the company’s success.
Core Competencies
- Technology and Quality Leadership
- Esec is the quality and performance benchmark for the industry
- Our price/performance ratio is a key competitive advantage
- Market Leader in attractive Die Attach Segment
- We are the market leader for Die Attach equipment since the introduction of this technology
- Global Presence / Qualified Employees
- Local presence in all key semiconductor backend markets with customer support centers (CSC) and highly qualified employees
- Flexibility
- Esec has a reputation of being one of the most flexible business partners within the industry