Esec

Duiven, the Netherlands, October 29, 2009 - BE Semiconductor Industries N.V. ("the Company" or "Besi") (Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its financial results for the third quarter ended September 30, 2009.

Highlights Third Quarter 2009

• Revenues increased by 59.7% to € 48.7 million vs. € 30.5 million in Q2-2009 due primarily to increased die bonding shipments and improved industry conditions
• Orders up € 15.4 million or 41.1% vs. Q2-2009 as growth experienced in entire assembly portfolio
• Net loss of € 3.2 million in Q3-2009 including net gain of € 2.7 million as compared to net income of € 31.5 million in Q2-2009 including net gain of € 42.4 million primarily related to Esec acquisition
• Solid financial position maintained at September 30, 2009:
  - Cash of € 68.0 million. Net cash of € 14.3 million
  - € 49.2 million cash in excess of bank/lease debt

Strategic Agenda and Outlook

• Hungarian die bonding facility sold. Asian production transfer continues
• Esec update: Favorable revenue, order and profit development trends. 30% headcount reduction achieved. Integration on track
• Further reduction of adjusted net loss for Q4-2009 anticipated.

Comment

Richard W. Blickman, President and Chief Executive Officer of the Company, commented: "Our third quarter results reflect continued sequential improvement in our 2009 financial performance. Such improvement can be seen in our revenue and order development as well as in a reduction of adjusted net losses during the period. Our performance has improved primarily due to the timely acquisition of Esec, a material improvement in general economic conditions globally in comparison to the winter 2008/2009 and benefits realized from our Dragon II restructuring efforts and integration of Esec into Besi's operations.

During the third quarter, customers, primarily Asian subcontractors, significantly increased their demand for incremental capacity and new product development as the stabilization of the global economy continued and signs of potential growth emerged, particularly in Asian markets. As such, our orders increased by approximately € 15.4 million, or 41.1%, compared to the second quarter of 2009 as we experienced strong bookings growth for both our die attach and packaging and plating equipment products consistent with typical order patterns in an industry recovery.

Our net loss for the third quarter of 2009, including € 2.7 million of one-time and other adjustments, was € 3.2 million as compared to net income of € 31.5 million in the second quarter of 2009 including a € 42.2 million gain primarily related to the Esec acquisition. On a comparable basis our adjusted net loss decreased from € 10.9 million to € 6.0 million. During the third quarter, sequential revenue growth exceeded our guidance as the revenue ramp was steeper than previously anticipated. In addition, operating expenses declined by 10% sequentially primarily related to lower development spending. We expect adjusted losses to reduce further in the fourth quarter due to higher gross margins and a more favorable product mix. The Company continues to focus on additional measures for revenue enhancement and cost reduction company-wide through the One Besi concept to restore profitability.

Besi also continued to make progress on its strategic agenda this quarter. We completed our targeted Esec headcount reduction, sold our Hungarian die bonding operations and terminated all remaining employees related thereto. In addition, key European personnel were transferred to our Malaysian manufacturing operations to accelerate the further transfer of European system production and support the large revenue ramp we experienced during the quarter. Further, our Esec acquisition and integration efforts have contributed positively to the Company's development. Subsequent to its acquisition, revenue, order and profit trends continue favorably at Esec and have exceeded our expectations. Finally, to further enhance our technological leadership, our development program for next generation singulation and die sorting systems remains on target for commercial introduction in 2010."

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