Esec


Products

Products

High Performance through Innovative Assembly Solutions

Esec, a leading global provider of chip assembly equipment and system solutions for the semiconductor industry, serves customers with innovative back-end products and solutions. 

Esec's core business encompasses Die Bonders, Wire Bonders, and Flip Chip Bonders, along with high precision equipment for the assembly of optoelectronic and MEMs components, and smart card packaging technology.

Contact
Sales & Service
Josef Schuler
T: +41 41 749 51 11
sales.esec@besi.com
Esec AG
Hinterbergstrasse 32
6330 Cham
Switzerland
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