Products by Packages
Click on the desired application and we'll show you the Esec products that are eligible to suit your needs.
- BGA, BGA-CSP, FBGA
- BOC
- PiP (Package in Package)
- Power Devices (SOT, TO-220, TO-247, DPAK, Power QFN, Power SO)
- QFN, QFP
- Sensor Packages (MEMS, Image Sensors, etc.)
- SiP, MCP
- Smart Card Module, Contactless Module
- TSSOP, SOIC, SOT, SC, PLCC
BGA, BGA-CSP, FBGA
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- Wire Bonder
- 3200
- 3100optima
- Flip Chip Bonder
- 2100 FC
BOC
- Wire Bonder
- 3200
- 3100optima
PiP (Package in Package)
- Die Bonder
- 2008 hSplus
- 2008 hS3plus
Power Devices: SOT, TO-220, TO-247, DPAK, Power QFN, Power SO
- Die Bonder
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
- Wire Bonder
- 3200
- 3100optima
QFN, QFP
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- Wire Bonder
- 3200
- 3100optima
- Flip Chip Bonder
- 2100 FC
TSSOP, SOIC, SOT, SC, PLCC
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- Wire Bonder
- 3200
- 3100optima
- Flip Chip Bonder
- 2100 FC
Sensor Packages (MEMS, Image Sensors, etc.)
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- Wire Bonder
- 3200
- 3100optima
- Flip Chip Bonder
- 2100 FC
SiP, MCP
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
- Wire Bonder
- 3200
- 3100optima
- Flip Chip Bonder
- 2100 FC
Smart Card Module, Contact-less Module
- Die Bonder
- 2008 SCplus
- 2008 SC3plus
- Wire Bonder
- 3100 SC
- Contact
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Sales & Service
Josef Schuler
T: +41 41 749 51 11
sales.esec@besi.com
Esec AG
Hinterbergstrasse 32
6330 Cham
Switzerland
