Products by Processes
Click on the desired technology and we'll show you the Esec products that are eligible to suit your needs.
- 300mm
- Ball Bumping
- Boat handling
- Copper bonding
- Epoxy
- Eutectic
- Fine Pitch
- Flip Chip
- Inline Curing for Reel to Reel
- Jedec Tray Handling
- Reel to Reel
- Soft Solder
- Stacked Die
- Tape Cut and Place
- Thin Die
- Wafer Backside Adhesive (DAF/WBL Tape, Epoxy)
300mm
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hS3plus
- 2008 SC3plus
- Flip Chip Bonder
- 2100 FC
Ball Bumping
- Wire Bonder
- 3200
- 3100optima
Boat handling (singulated devices)
- Die Bonder
- 2008 hSplus
- 2008 hS3plus
Copper bonding
- Wire Bonder
- 3200
- 3100optima
- 3100 SC
Epoxy Dispensing
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- 2008 SCplus
- 2008 SC3plus
Eutectic
- Soft Solder Die Bonder
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
Fine Pitch
- Wire Bonder
- 3200
- 3100optima
Flip Chip
- Flip Chip Bonder
- 2100 FC
Inline Curing for Reel to Reel
- Die Bonder
- 2008 SCplus
- 2008 SC3plus
Jedec Tray Handling
- Die Bonder
- 2008 hS3plus
Reel to Reel
- Die Bonder
- 2008 SCplus
- 2008 SC3plus
- Wire Bonder
- 3100 SC
Soft Solder
- Soft Solder Die Bonder
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
Stacked Die
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- 2008 SCplus
- 2008 SC3plus
- Soft Solder Die Bonder
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
- Wire Bonder
- 3200
- 3100optima
Tape Cut and Place
- Die Bonder
- 2008 hS3plus
Thin Die Handling
- Die Bonder
- 2100 xP
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- 2008 SCplus
- 2008 SC3plus
- Soft Solder Die Bonder
- 2009 SSI
- 2007 SSIplus
- 2007 fSplus
- Flip Chip Bonder
- 2100 FC
Wafer Backside Adhesive (DAF/WBL Tape, Epoxy)
- Die Bonder
- 2100 sD
- 2008 hSplus
- 2008 hS3plus
- 2008 SCplus
- 2008 SC3plus
- Contact
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Sales & Service
Josef Schuler
T: +41 41 749 51 11
sales.esec@besi.com
Esec AG
Hinterbergstrasse 32
6330 Cham
Switzerland