Esec


Products

Products by Processes

Click on the desired technology and we'll show you the Esec products that are eligible to suit your needs.


300mm
Die Bonder
2100 xP
2100 sD
2008 hS3plus
2008 SC3plus
Flip Chip Bonder
2100 FC
Ball Bumping
Wire Bonder
3200
3100optima
Boat handling (singulated devices)
Die Bonder
2008 hSplus
2008 hS3plus
Copper bonding
Wire Bonder
3200
3100optima
3100 SC
Epoxy Dispensing
Die Bonder
2100 xP
2100 sD
2008 hSplus
2008 hS3plus
2008 SCplus
2008 SC3plus
Eutectic
Soft Solder Die Bonder
2009 SSI
2007 SSIplus
2007 fSplus
Fine Pitch
Wire Bonder
3200
3100optima
Flip Chip
Flip Chip Bonder
2100 FC
Inline Curing for Reel to Reel
Die Bonder
2008 SCplus
2008 SC3plus
Jedec Tray Handling
Die Bonder
2008 hS3plus
Reel to Reel
Die Bonder
2008 SCplus
2008 SC3plus
Wire Bonder
3100 SC
Soft Solder
Soft Solder Die Bonder
2009 SSI
2007 SSIplus
2007 fSplus
Stacked Die
Die Bonder
2100 xP
2100 sD
2008 hSplus
2008 hS3plus
2008 SCplus
2008 SC3plus
Soft Solder Die Bonder
2009 SSI
2007 SSIplus
2007 fSplus
Wire Bonder
3200
3100optima
Tape Cut and Place
Die Bonder
2008 hS3plus
Thin Die Handling
Die Bonder
2100 xP
2100 sD
2008 hSplus
2008 hS3plus
2008 SCplus
2008 SC3plus
Soft Solder Die Bonder
2009 SSI
2007 SSIplus
2007 fSplus
Flip Chip Bonder
2100 FC
Wafer Backside Adhesive (DAF/WBL Tape, Epoxy)
Die Bonder
2100 sD
2008 hSplus
2008 hS3plus
2008 SCplus
2008 SC3plus
Contact
Sales & Service
Josef Schuler
T: +41 41 749 51 11
sales.esec@besi.com
Esec AG
Hinterbergstrasse 32
6330 Cham
Switzerland
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