Esec

In October 1999, Esec and OMG (formerly DMC²), in collaboration with Darmstadt's University of Technology, started a project to develop a lead-free, non-toxic soft solder for die attach.

The goal of the project was to develop a drop-in replacement for the lead-based solder commonly used in die attach applications. Therefore, the solder had to be available in wire form and usable on existing die-bonder equipment, including the Esec softsolder dispenser (SSD).

After evaluating hundreds of different possible alloys, Esec and the project partners have found a candidate to replace lead-based solders for die attach. The new alloy was presented for the first time at the Semicon China 2002 trade fair in Shanghai. Esec has a patent pending for its new award–winning solder.

For detailed information, please download the paper presented at Semicon China 2002.

The lead-free solder is available in wire form. Samples for testing and evaluation purposes are available. To obtain a sample of the lead-free solder or additional information, please click here.